ISASE-MAICS 2018

It is our great pleasure to welcome you to attend ISASE-MAICS 2018
the 4th International Symposium on Affective Science and Engineering, and the 29th Modern Artificial Intelligence and Cognitive Science Conference to be held in Spokane, WA, USA on May 31(Thu.)-June 2(Sta.), 2018. The main objective of this joint conference is to bring together academics, engineers, manufacturers, and government officials to present and exchange knowledge, experience, results, and information related to the broad aspects of methodologies employed in affective science and engineering, artificial intelligence, and cognitive science. Affective engineering and artificial intelligence provide a new field and propelling technology that can enable us to bridge gaps between humans and systems. The scope of this join conference covers all fields of advanced technology and science, manufacturing, production as well as design that are related to affection and intelligence.

ISASE-MAICS 2018 CFP→PDF

This joint conference will be held at EWU Spokane that is home to Eastern’s newest college, https://www.ewu.edu/spokane/
the College of Health Science and Public Health, as well as the College of Business and Public Administration. Spokane is a cozy city that attracts many people as their homes. Surrounded by rich nature and peaceful neighbors, Spokane serves as the cultural, economical and medical hub of the Inland Empire — Eastern Washington, Northern Idaho and Western Montana. Spokane is home to many higher education — Eastern Washington University, Washington State University, University of Washington, Gonzaga University, Whitworth University, and Community Colleges of Spokane. Nishinomiya, Hyogo, Japan, has been a sister city since 1961. There are the Nishinomiya Tsutakawa Japanese Garden and the Mukogawa Fort Wright Campus, an international branch of Mukogawa Women University, throughout this long established relationship. Expo ’74, the first environmentally themed world’s fair was held in the downtown area.

Affective engineering and artificial intelligence provide new fields and propelling technologies that enable us to bridge gaps between humans and systems. The scope of this joint conference covers all fields of advanced technology and science, manufacturing, and production as well as design represented as topics including but not limited to the following:

Note to the international authors in need of B1/B2 visa to enter the US: Please submit your paper by January 15, 2018 for the fast track peer review so that we notify you around February 15th with a visa application support letter. Please clearly indicate that the prospective presenter of your paper(s) needs the B1/B2 visa to enter the US.

Papers must be submitted via the symposium web site is required. Submitted papers should be in the ISASE’s format, and should contain up to 5 keywords. Papers will be evaluated for originality, significance, clarity, and soundness, and will be reviewed by at least two independent reviewers. The detailed submission procedure will be appeared in the web site.